VIDYA KRISHNAMOORTHY; SHEEJA RAJIV. An eco-friendly top down approach to nutrient incorporated electrospun seed coating for superior germination potential. JOURNAL OF ADVANCED APPLIED SCIENTIFIC RESEARCH, [S. l.], v. 1, n. 7, 2017. DOI: 10.46947/joaasr17201754. Disponível em: http://joaasr.com/index.php/joaasr/article/view/54. Acesso em: 8 may. 2024.