Vidya Krishnamoorthy, and Sheeja Rajiv. “An Eco-Friendly Top down Approach to Nutrient Incorporated Electrospun Seed Coating for Superior Germination Potential”. JOURNAL OF ADVANCED APPLIED SCIENTIFIC RESEARCH 1, no. 7 (January 6, 2017). Accessed May 7, 2024. http://joaasr.com/index.php/joaasr/article/view/54.